鼎博体育 experts located in our World Class Design Centers can work with customers to design and engineer top quality packaging for product requirements
鼎博体育’s design engineers are trained experts and experienced in the latest design tools and packaging technology. We process thousands of new package designs for customers every year for existing or next-generation products. Our world-class design centers are strategically located in the United States, Korea, China, the Philippines, Portugal, and Taiwan to reduce design cycle times and provide customers with expert advice.
鼎博体育 incorporates Design for Cost (DFC) and Design for Manufacturing (DFM) when Designing for Performance (DFP). Our highly trained and experienced design staff can provide leadframe, laminate or wafer level design services.
Chip Package Board Co-Design/Co-Verification
鼎博体育 has the experience and expertise to verify customer designs meeting stringent system level requirements using our chip package board co-design and co-verification process.