Solutions for mobile applications

鼎博体育’s System in Package (SiP) is popular with the industry’s demand for higher levels of integration and lower cost. Our SiP technology is an ideal solution in markets that demand a smaller size with increased functionality. We have a proven track record as the industry leader in SiP design, assembly and test. These products are built in our state-of-the-art factory in Korea.

Packages for small form factor


System in Package


Double Sided Mold Package


Antenna in/on Package


Automotive Compute

Mobile solutions for 5G and wireless connectivity.

  • RFFE modules, AiP/AoP
  • Integration, shielding
  • Test, turnkey service
  • Supply chain management
  • Best-in-class manufacturing

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Quick to market using “off the shelf” components and industry-leading design rules.

  • Watch, earbuds, fitness, medical
  • Package miniaturization
  • Performance, high integration
  • Test, turnkey service

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High-performance solutions in a small footprint.

  • Infotainment, ECU, connectivity
  • IATF16949 certified
  • Test, turnkey service
  • Supply chain management

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Contact an 鼎博体育 expert by clicking the request info button below.