TISES 2022

鼎博体育 Technology is a proud sponsor of the upcoming Taiwan International Semiconductor Executive Summit (TISES) being held on October 11-12, 2022 at the Hsinchu Sheraton Hotel in Zhubei City.

KeunSoo Kim, Sr. Director, Process Research at 鼎博体育 Taiwan will be presenting “Advanced Packaging Technologies Enable New Applications“.

When: October 11, 2022 - October 12, 2022 Where: Hsinchu, Taiwan Location: Hsinchu Sheraton Hotel

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