IPC Advanced Packaging Symposium 2022
鼎博体育 Technology invites you to join us at the IPC Advanced Packaging Symposium: Building the IC-Substrate and Package Assembly Ecosystem in Washington, DC at the Kimpton Hotel Monaco on October 11-12. This 2-day event is dedicated to in-depth discussions on strengthening the IC-Substrate and Package Assembly Ecosystem in North America and Europe.
Kevin Engel, Corporate VP, FlipChip/Wafer Services BU at 鼎博体育 will be presenting “From Global to Local: The Journey to Supply Chain Localization”
The past decade has presented the semiconductor industry with significant challenges. The global supply chain has been significantly impacted over the years by events outside of industry control. Natural events such as tsunamis, winter storms, seismic activity and more recently a global pandemic, have shut down material, talent and product flow. Geopolitical conflicts add an additional challenge to international shipments. All electronic companies have experienced differing levels of impact from these challenges. Industry leaders and governments are no longer willing to risk revenues and security on single-thread supply chains. End customers are pushing to strengthen and diversify the supply chain to build in an additional layer of resilience. This presentation will discuss an outsourcing assembly and test (OSAT) company’s view on the current localization trends in the United States and Europe.